Title: Scientific staff (CEA-LETI)
Phone: +33 (0)18.104.22.168.56
He is graduated from National School of Physics of Grenoble in 2001 and obtained his Phd degree in crystallography from University Joseph Fourier of Grenoble in 2006.
He joined the 3D wafer level packaging group of CEA-Leti in 2008. He has been working for more than 10 years in Through silicon vias, 3D interconnections and silicon interposers technology. His research interests include High Performance computing, Silicon Photonics Interposer as well as cryo-packaging for Quantum architecture applications.
He is currently in charge of coordinating the High Density 3D Integration group within the 3D Packaging Laboratory of CEA-Leti.